黏弹性封装层合异质结构动力学行为分析
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国家自然科学基金资助项目(12172282, 12402002), 山东省自然科学基金(ZR2024QA062), 广东省基础与应用基础研究基金项目(2024A1515010767), 青岛市自然科学基金(24-4-4-zrjj-7-jch),中央高校基本科研业务费专项资金

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    摘要:

    在生物医学和仿生皮肤等领域,基于黏弹性材料封装的薄膜/基底结构因其卓越的力学性能展现出广阔的应用前景.然而,基于黏弹性材料封装的薄膜/基底结构制造的可延展电子器件在实际应用中经常面临高温、高频等复杂环境的挑战,这些因素严重威胁到电子器件的性能和可靠性.故而,本文旨在研究黏弹性材料封装的薄膜/基底结构在外加载荷下的非线性动态力学响应.首先,建立黏弹性材料封装的三层薄膜基底结构的动力学模型;其次,根据扩展的拉格朗日方程建立三层结构的控制方程;最后,通过对比辛Runge-Kutta法和经典Runge-Kutta法,验证了辛Runge-Kutta法在保能量方面的优势,讨论了黏弹性材料参数对薄膜/基底结构动力学响应的影响规律.本文研究结果将为基于黏弹性封装的柔性电子设计提供理论参考.

    Abstract:

    In the fields of biomedicine and biomimetic skin, film/substrate structures encapsulated with viscoelastic materials have shown broad application prospects due to their excellent mechanical properties. However, stretchable electronic devices made from film/substrate structures encapsulated with viscoelastic materials often face challenges in complex environments such as high temperatures and high frequencies in practical applications, which seriously threaten the performance and reliability of electronic devices. Therefore, this paper aims to study the nonlinear dynamic mechanical response of film/substrate structures encapsulated with viscoelastic materials under external loads. First, a dynamic model of the three-layer film/substrate structure encapsulated with viscoelastic materials is established; second, the governing equations for the three-layer structure are formulated based on the extended Lagrange equations; finally, by comparing the symplectic Runge-Kutta method with the classical Runge-Kutta method, the energy preservation advantage of the symplectic Runge-Kutta method is verified, and the influence of viscoelastic material parameters on the dynamic response of the film/substrate structure is discussed. The results of this study will provide theoretical references for the design of flexible electronics based on viscoelastic encapsulation.

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引用本文

陈浩,毕皓皓,张博涵,王博.黏弹性封装层合异质结构动力学行为分析[J].动力学与控制学报,2025,23(3):82~90; Chen Hao, Bi Haohao, Zhang Bohan, Wang Bo. Dynamic Behavior Analysis of Viscoelastic Encapsulated Film Substrate Structures[J]. Journal of Dynamics and Control,2025,23(3):82-90.

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  • 收稿日期:2024-12-05
  • 最后修改日期:2025-02-06
  • 在线发布日期: 2025-03-25
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