An active vibration isolation strategy is designed for semiconductor machining equipment. The internal parameter characteristics of the vibration isolation mechanism are analyzed and a dynamic model of the vibration isolation mechanism is established. Due to the fact that the isolation device of semiconductor processing equipment consists of a baseframe, vibration isolation mechanism, and various components supported by the vibration isolation mechanism, the dynamic model of the isolation mechanism considers the baseframe, vibration isolation mechanism, and support components as a secondary isolation system to simulate the isolation device. A control algorithm combining active disturbance rejection control and absolute velocity feedback control are designed for the vibration isolation mechanism. A simulation model based on the vibration isolation mechanism and control algorithm for semiconductor processing equipment is built, and two important indicators, transmissibility and compliance, are given Finally, the performance of the active vibration isolation strategy is verified through experiments. According to the two indicators of transmissibility and compliance, it is proven that the designed control algorithm performs better than commonly used control algorithms.